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Stacked SN745510NE chips with heatsink.

Overview

If you are using an H-Bridge driver chip such as the SN754410NE or LM293D and would like to increase the output of the driver circuit, consider stacking more than one driver chip in parallel.  Since each chip can continuously sink 1 amp (in the case of the SN754410NE ), then using two chips in parallel will give you double the continuous rating or 2 amps.  If the circuit is already designed and you don't want to make another PCB or tear up your hand soldered connections, you can even piggy-back such a chip on top of another and solder the leads together.  If you are still designing the PCB or have not yet heated up your soldering iron, just use two sockets or PCB spaces for the two (or more) chips and wire them in parallel. 

Heat Considerations

In the case of piggybacking the chips, the heat generated by the two chips will be double that of one along with the current capabilities.  Use of a slip-on or glue-on heat sink is recommended. 

Source Current Considerations

Again, the current demands on your logic circuit that drives the H-Bridges will be doubled.  If this doubled current demand exceeds the sourcing/sinking current of the driving logic, you will need interfacing circuitry to avoid overloading the logic.  This can often be accomplished with just a 7400 series logic chip. 

Related Links:

Driving High-Current Loads from Logic Article

Acroname Supported H-Bridge Standard